Huawei announced its mobile processing solutions at the recent ISCAS 2026 event
Huawei announced the latest development trends of its mobile processors at the recent ISCAS 2026 event, and revealed that Kirin chips will soon break through the existing performance bottlenecks. He Tingbo, Huawei’s director and president of semiconductor business, reviewed the brand’s development in the chip field at the meeting, pointing out that Huawei has been facing challenges in 5G chip manufacturing since being subject to external restrictions in 2020. Although the Kirin 9030 Pro launched last year successfully brought the brand back to the 5G market and improved performance, the manufacturer admitted that the chip has reached a technological saturation zone, with limited room for innovation, and there is still a gap with other competitors on the market in terms of overall computing performance.
In order to solve this technical limitation, Huawei officially released a new chip design architecture called LogicFolding. He Tingbo pointed out that facing the physical limits of traditional geometric reduction technology, the R&D team found a new path based on the law of time reduction. Future Kirin chips will introduce a new double-layer design to replace the existing single-layer structure. This can significantly increase the transistor density, thereby achieving a substantial improvement in mobile chip performance without completely relying on the most advanced foundry processes.
This new technology marks a change in Huawei’s semiconductor research and development direction, focusing on making up for process limitations through innovation in the underlying architecture. According to the manufacturer, this new generation of Kirin chips using Logic Folding double-layer design is expected to officially enter the mass production stage in 2027 or later, and will be used in future Huawei flagship mobile phones. This means that future new Huawei phones are expected to narrow the technical gap in the current market in terms of computing power and power consumption control, providing users with a more competitive practical operating experience.
