Xiaomi officially released a new generation of self-developed 3nm flagship processor “Xuanjie O3” and confirmed that it will be equipped with the new folding screen mobile phone Xiaomi 18 Fold for the world premiere in September. This new chip adopts a unique ten-core “full big core” architecture, with a maximum frequency of 4.35GHz, and native support for the latest LPDDR6 memory. According to official data, its running score exceeded 5.22 million!
Xiaomi officially released the new generation of its self-developed flagship processor “Xuanjie O3” at an online technical communication meeting, and simultaneously announced the chip architecture details and product launch schedule. It announced that the new folding screen mobile phone Xiaomi 18 Fold will be the first mass-produced model equipped with Xuanjie O3 and is expected to be officially launched on the market in September this year.
In terms of specifications, Xuanjie O3 is manufactured using the 3nm flagship process, with a die size of 133 square millimeters and 24 billion transistors integrated internally. The overall chip size is 26% higher than the previous generation Xuanjie O1. The core architecture adopts a relatively rare ten-core “full large core” design, consisting of 6 ultra-large cores and 4 large cores, divided into three levels: C1-Ultra, C1-Premium and C1-Pro, completely abandoning the energy-saving small core cluster in traditional chips.
In terms of frequency performance, the highest-end C1-Ultra ultra-large core clocks at 4.35GHz, the C1-Premium ultra-large core clocks at 3.68GHz, and the C1-Pro core clock also reaches 3.15GHz. In terms of memory support, Xuanjie O3 natively supports the latest LPDDR6 specification and is backward compatible with existing LPDDR5X solutions.
Actual performance measurement data shows that Xuanjie O3’s total running score in the laboratory test environment exceeded 5.22 million points (5,228,014 points), setting a new performance record for flagship chips in the Android camp at this stage. Xiaomi 18 Fold equipped with this chip is expected to be officially released in September, which will bring to the market a new choice of folding screen flagships with all large-core self-developed chips.
